DX UV/Green Series Nanosecond Lasers
DX UV/Green Series Nanosecond Lasers
Description
With new revolutionary packaging, our new DX Series has smaller form factor, higher performance, shorter pulse widths compared to its ancestor, the DSH series, providing the most compact 15W to 55W of UV and 25W to 100W of Green output power with short pulse width — in addition to longer pulse versions.Owing to key patented technologies that provide non-consumable THG crystals with no indexing required, intracavity harmonic generation is an inherently more efficient harmonic conversion that provides better pulse-to-pulse stability and mode quality in a simple, compact laser configuration.
With standard Total Pulse Control features such as PEC and Duty Control, pulse energy and pulse width, which can be held constant over wide ranges of repetition rates for tight process control at fast speeds. Higher power and faster throughput contributes to a low cost of operation. The All-In-One (AIO) design combines common optical, electrical and command interfaces in a rugged industrial package for simple integration into 24/7 precision micromachining in extended production cycle environments.
Advantages
- High Power (up to 55W) UV and (up to 100W) Green laser.
- The most compact rugged All-in-One ns laser.
- The Highest Pulse Energy UV ns laser on the market >1mJ@50kHz.
- The Highest Pulse Energy UV ns laser on the market >1mJ@50kHz.
- The highest wall plug efficiency ns laser:
~17% for green
~10% for UV - Patented intracavity UV generation.
- Excellent TEM00 beam with typical M² < 1.2.
- Superior stability < 2%.
- Exceptional Beam Pointing Stability < 25 μrad.
- Total pulse control (PEC, Duty Control, etc.).
Specification
Model | DX-355-15 | DX-355-20 | DX-355-28 | DX-355-40 | DX-355-50 |
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Output Characteristics |
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Average Power | 15 W at 50 kHz | 20 W at 50 kHz | 28 W at 60 kHz | 40 W at 60 kHz | 50 W at 70 kHz |
Pulse Energy | ~ 0.3 mJ | ~ 0.4mJ | ~ 0.6 mJ | ~ 1 mJ | ~ 1 mJ |
Pulse Width (nominal) | 12 ± 3 ns @ 50 kHz | 12±3 ns @ 50kHz | 12 ± 3 ns @ 50 kHz | 12±3 ns @ 50 kHz | 12±3 ns @ 50 kHz |
Repetition Rate | Single Shot to 200 kHz (Option to 300 kHz) | Single Shot to 200 kHz (Option to 300 kHz) | Single Shot to 200 kHz (Option to 300 kHz) | Single Shot to 200 kHz (Option to 300 kHz) | Single Shot to 200 kHz (Option to 300 kHz) |
Pulse to Pulse Stability | < 2% rms | < 2% rms | < 2% rms | < 2% rms | < 2% rms |
Long Term Stability (8 hr ± 1° C) | < ±2% | < ±2% | < ±2% | < ±2% | < ±2% |
Beam Characteristics |
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Polarization Ratio | Horizontal; > 100:1 | Horizontal; > 100:1 | Horizontal; > 100:1 | Horizontal; > 100:1 | Horizontal; > 100:1 |
4σ Beam Diameter @ exit (nominal) | ~ 0.6 mm** | ~ 0.6 mm** | ~ 0.6 mm** | ~2.5mm | ~2.5mm |
Beam Divergence (Full Angle Far Field) | <1.5 mrad | <1.5 mrad | <1.5 mrad | <1.5 mrad | <1.5 mrad |
Beam Circularity | ~ 90% | ~ 90% | ~ 90% | ~ 90% | ~ 90% |
Spatial Mode | TEM00 M² < 1.2 | TEM00 M² < 1.2 | TEM00 M² < 1.2 | TEM00 M² < 1.2 | TEM00 M² < 1.2 |
Beam Pointing Stability | < 25 μrad | < 25 μrad | < 25 μrad | < 25 μrad | < 25 μrad |
Operating Specifications |
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Interface | Ethernet / RS 232 / GUI / External TTL Triggering | Ethernet / RS 232 / GUI / External TTL Triggering | Ethernet / RS 232 / GUI / External TTL Triggering | Ethernet / RS 232 / GUI / External TTL Triggering | Ethernet / RS 232 / GUI / External TTL Triggering |
Warm Up Time | <15 minutes from stand by, < 30 minutes from cold start | <15 minutes from stand by, < 30 minutes from cold start | <15 minutes from stand by, < 30 minutes from cold start | <15 minutes from stand by, < 30 minutes from cold start | <15 minutes from stand by, < 30 minutes from cold start |
Electrical Requirement | 100 to 240 V AC | 100 to 240 V AC | 100 to 240 V AC | 100 to 240 V AC | 100 to 240 V AC |
Line Frequency | 50 to 60 Hz | 50 to 60 Hz | 50 to 60 Hz | 50 to 60 Hz | 50 to 60 Hz |
Relative Humidity | Non-condensing, 90% Max | Non-condensing, 90% Max | Non-condensing, 90% Max | Non-condensing, 90% Max | Non-condensing, 90% Max |
Power Consumption (excluding chiller) | < 240 W typical | < 240 W typical | < 320 W typical | < 420 W typical | < 600 W typical |
Ambient Temperature | 15°C to 35°C (59° to 95°F) Operating Range | 15°C to 35°C (59° to 95°F) Operating Range | 15°C to 35°C (59° to 95°F) Operating Range | 15°C to 35°C (59° to 95°F) Operating Range | 15°C to 35°C (59° to 95°F) Operating Range |
Storage Conditions | -10°C to 40°C; Sea Level to 12,000 m; 0% to 90% RH, non-condensing | -10°C to 40°C; Sea Level to 12,000 m; 0% to 90% RH, non-condensing | -10°C to 40°C; Sea Level to 12,000 m; 0% to 90% RH, non-condensing | -10°C to 40°C; Sea Level to 12,000 m; 0% to 90% RH, non-condensing | -10°C to 40°C; Sea Level to 12,000 m; 0% to 90% RH, non-condensing |
Physical Characteristics |
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Dimensions (W x H x L) | 7.5 in x 3.75 in x 16 in | 7.5 in x 3.75 in x 16 in | 7.5 in x 3.75 in x 16 in | 8.5 in x 3.75 in x 20 in | 8.5 in x 3.75 in x 20 in |
Weight | 29 lbs | 29 lbs | 29 lbs | 43 lbs | 43 lbs |
Applications
- ITO Patterning
- Flex PCB de-paneling, cutting and PCB drilling
- Via Hole Drilling
- Ceramic scribing, cutting and drilling
- Solar Cell Scribing and PERC Processing
- Silicon Wafer Scribing and Singulation : Full-cut wafer dicing & Low-k dielectric grooving
- UV reel to reel on the fly Converting process
- Metal foil cutting and Copper processing
- Glass and ceramic processing, cutting and drilling
- UV Welding Carbon Fiber