TEM00 PULSE PUMPED LASERS
Description
1064nm
532nm
355nm
250W @1MHz
200W @1MHz
150W @ 1MHz
100W @ 1MHz
40W @ 1MHz
10W @ 1MHz
175W @600kHz
140W @600kHz
100W @ 600kHz
70W @ 600kHz
25W @ 600kHz
5W @600kHz
75W @600kHz
60W @600kHz
50W @ 600kHz
28W @ 600kHz
10W @ 600kHz
3W @600kHz
2.5mJ @100kHz
2mJ @100kHz
1.5mJ @ 100kHz
1mJ @ 100kHz
400µJ @ 100kHz
100µJ @ 100kHz
290µJ @600kHz
230µJ @600kHz
160µJ @ 600kHz
115µJ @ 600kHz
40µJ @ 600kHz
8µJ @ 600kHz
125µJ @600kHz
100µJ @600kHz
80µJ @ 600kHz
45µJ @ 600kHz
10µJ @ 600kHz
5µJ @ 600kHz
1064nm
532nm
355nm
250W @1MHz
200W @1MHz
150W @ 1MHz
100W @ 1MHz
40W @ 1MHz
10W @ 1MHz
175W @600kHz
140W @600kHz
100W @ 600kHz
70W @ 600kHz
25W @ 600kHz
5W @600kHz
75W @600kHz
60W @600kHz
50W @ 600kHz
28W @ 600kHz
10W @ 600kHz
3W @600kHz
2.5mJ @100kHz
2mJ @100kHz
1.5mJ @ 100kHz
1mJ @ 100kHz
400µJ @ 100kHz
100µJ @ 100kHz
290µJ @600kHz
230µJ @600kHz
160µJ @ 600kHz
115µJ @ 600kHz
40µJ @ 600kHz
8µJ @ 600kHz
125µJ @600kHz
100µJ @600kHz
80µJ @ 600kHz
45µJ @ 600kHz
10µJ @ 600kHz
5µJ @ 600kHz
applications
- Glass Cutting, engraving and drilling.
- Through Glass Via (TGV) and interposer processing.
- Semiconductor and Microelectronics Processing.
- Precision Micromachining of metals and ceramics.
- Medical Device Manufacturing.
-
Foils and Films for Batteries and Superconductor.
Key Features
- Up to ~500µJ Pulse Energy at 600kHz
- True TEM00 Output, M2 <1.3
- Ultra-Short Pulse Widths (10ps @1064nm)
- Dynamic Pulse Energy Control – PEC
- Position Synchronized Output – PSO
- Robust & Compact Form Factor
- Power Monitoring and Self-Calibration