DX &DX LP Series
Description
Engineered for reliability and compact efficiency, the DX & DC Laser Series provide high-performance solutions for cutting, marking, and microfabrication. The DC Series offers air-cooled stability for 3D printing and PCB processing, while the DX-AC Series delivers compact precision for solar cell scribing. For wafer dicing and material removal, the DX Long Pulse Series ensures high-energy, water-cooled performance, while the DX2 Series excels in fast, short-pulse processing for semiconductors and surface ablation.
Long pulse nanosecond laser
nanosecond laser
applications
- Glass Cutting, engraving and drilling.
- Through Glass Via (TGV) and interposer processing.
- Semiconductor and Microelectronics Processing.
- Precision Micromachining of metals and ceramics.
- Medical Device Manufacturing.
-
Foils and Films for Batteries and Superconductor.
Key Features
- Up to ~500µJ Pulse Energy at 600kHz
- True TEM00 Output, M2 <1.3
- Ultra-Short Pulse Widths (10ps @1064nm)
- Dynamic Pulse Energy Control – PEC
- Position Synchronized Output – PSO
- Robust & Compact Form Factor
- Power Monitoring and Self-Calibration